The Koch-Chemie Micro Cut Pad is made from high-quality specialised sponge designed to remove fine scratches, holograms, and polishing marks in collaboration with Koch-Chemie M3 Micro Cut Compound. The short height of 23mm creates low torsion forces whilst providing a high level of stability and excellent handling. The unique density of the foam enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count provides a high level of abrasiveness and increases the lifespan of the pad. The milling edge enables increased flexibility, allowing them to move around contours more easily.

• Compression hardness: 10
• Abrasiveness: 5

Koch Chemie 2-step polishing system

To achieve an ideal polishing result, it is not enough just to use an excellent polishing paste. Besides the polisher and expertise in application, the quality of a polishing pad is just as important. Koch Chemie has a two-step system, as opposed to the usual three-step system used by competitors. This allows for significant time savings.

Step 1: H9.01 or F6.01

Step 2: M3.02 or P3.01

Step 3: Optional gloss polish or coating -> if step 3 then do not use P3.01 as it already contains wax.

Remove swirls & marring

Swirls are scratches in the paintwork that look like circles/circles. Marring is the name for scratches created during car claying with a clay bar or cleaning clay. These surface scratches are not deep in the paint, so you can easily remove this paint damage by polishing with this purple foam polishing pad.